RV200 oz Radeon 7500

Ža ti morem pokvarit veselje, ampak ne to ne bo šlo. To je podobno, kot bi hotel R9600, ki ima jedro RV350 pretvorit v R9800, ki ima jedro R350.
Ta jedra so fizično drugačna in nobena čarovnija ti ne pomaga, da boš pretvoril radeona 7500 v 8500.

IIRC 8500 niso ble Delux itd., pač pa Retail (275/275 + 1 RAMDAC na PCBju), LE (250/250), LELE, ...

Vrag te vzel Tom, to so uradne(ATijeve) oznake.

Najdi mi link, specifikacije.

No way, kuglvinkl, ta zadeva ima BGA module! Podobno kot tisti Sparklov "GeForce4 Titanium 4200 Gold! - Best of GF4 Ti"

Kaj mi res noče noben povedat kaj so BGA moduli. In zakaj naj bi bilo to tako

TSOP



BGA


BGA does not use pins for attachment. Instead, connections are made with small balls of solder on the PCB. In the ever-increasing move to smaller signal traces in electronics, this allows a shorter connection distance and higher connector density than TSOP. The TSOP and BGA pictures above are at the exact same scale, so another advantage is the really tiny size that can be achieved with BGA memory. This design should also improve heat dissipation.

In fact, Kingmax does not even provide heatspreaders with this DDR500 and DDR466 memory. Almost every other memory manufacturer tells us that heatspreaders are needed at these high speeds, but Kingmax says they are not needed with the tiny BGA design. As memory speeds have gone up in recent months, so has the temperature. Particularly in tight SFF cases, high-speed memory can get blazingly hot. The thin small Kingmax memory is like a breath of fresh air in those configurations where heat is a problem.